Description
Product ID
ICK BGA 25 x 25 x 6
Product Category
For Processors
Description
25 x 25 x 6 mm, for IC design BGA and others
Parameters
Features
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 25mm |
| height | 6mm |
| plate thickness | 1.8mm |
| length | 25mm |
| thermal resistance | 21.25 – 7.75K/W |
| dissipation loss | 2.8W |
| surface | black anodised |
