Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
ICK PGA 11 x 11
For Processors
27,95 x 24,76 x 15,2 mm, for IC design PGA and others
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 27.95mm |
| height | 15.24mm |
| plate thickness | 3.5mm |
| length | 24.76mm |
| thermal resistance | 10.9 – 2.6K/W |
| dissipation loss | 4.5W |
| surface | black anodised |
ICK PGA 11 x 11
For Processors
27,95 x 24,76 x 15,2 mm, for IC design PGA and others
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 27.95mm |
| height | 15.24mm |
| plate thickness | 3.5mm |
| length | 24.76mm |
| thermal resistance | 10.9 – 2.6K/W |
| dissipation loss | 4.5W |
| surface | black anodised |
| Surface | |
|---|---|
| Length (mm) | 24.76 |
| Width (mm) | 27.95 |
| Height (mm) | 15.24 |
DAU Components Limited
68 – 74 Barnham Road, Barnham West Sussex, PO22 0ES, UK
Tel: +44 (0) 1243 553031
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