Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
ICK PGA 18 x 18
For Processors
45,7 x 45,7 x 16,5 mm, for IC design PGA and others
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 45.7mm |
| height | 16.51mm |
| plate thickness | 4mm |
| length | 45.7mm |
| thermal resistance | 8.4 – 2.2K/W |
| dissipation loss | 7.2W |
| surface | black anodised |
ICK PGA 18 x 18
For Processors
45,7 x 45,7 x 16,5 mm, for IC design PGA and others
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 45.7mm |
| height | 16.51mm |
| plate thickness | 4mm |
| length | 45.7mm |
| thermal resistance | 8.4 – 2.2K/W |
| dissipation loss | 7.2W |
| surface | black anodised |
| Surface | |
|---|---|
| Length (mm) | 45.7 |
| Width (mm) | 45.7 |
| Height (mm) | 16.51 |
DAU Components Limited
68 – 74 Barnham Road, Barnham West Sussex, PO22 0ES, UK
Tel: +44 (0) 1243 553031
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