Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
ICK S 25 x 25 x 12.5
For Processors
25 x 25 x 12.5 mm, pin heatsinks quadratic
| design | rectangle |
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 25mm |
| height | 12.5mm |
| plate thickness | 2mm |
| weight | 6g |
| length | 25mm |
| thermal resistance | 5.3 – 2.1K/W |
| dissipation loss | 14.1W |
| surface | Al-natural |
ICK S 25 x 25 x 12.5
For Processors
25 x 25 x 12.5 mm, pin heatsinks quadratic
| design | rectangle |
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| width | 25mm |
| height | 12.5mm |
| plate thickness | 2mm |
| weight | 6g |
| length | 25mm |
| thermal resistance | 5.3 – 2.1K/W |
| dissipation loss | 14.1W |
| surface | Al-natural |
| Surface | |
|---|---|
| Length (mm) | 25 |
| Width (mm) | 25 |
| Height (mm) | 12.5 |
DAU Components Limited
68 – 74 Barnham Road, Barnham West Sussex, PO22 0ES, UK
Tel: +44 (0) 1243 553031
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