Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
ICK S R 100 x 50
For Processors
Ø 100 x 50 mm, pin heatsinks round
| design | round |
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| diameter | 100mm |
| height | 50mm |
| plate thickness | 10mm |
| weight | 320g |
| thermal resistance | 2.3 – 0.3K/W |
| dissipation loss | 26W |
| surface | black anodised |
ICK S R 100 x 50
For Processors
Ø 100 x 50 mm, pin heatsinks round
| design | round |
| way of fixation | therm. conductive foil
therm. cond. adhesive |
| socket | universal |
| suitable for processor type | universal |
| diameter | 100mm |
| height | 50mm |
| plate thickness | 10mm |
| weight | 320g |
| thermal resistance | 2.3 – 0.3K/W |
| dissipation loss | 26W |
| surface | black anodised |
| Surface | |
|---|---|
| Height (mm) | 50 |
DAU Components Limited
68 – 74 Barnham Road, Barnham West Sussex, PO22 0ES, UK
Tel: +44 (0) 1243 553031
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