FK 269 MI 220 O
Board Level Heatsinks
| material | copper (Cu) |
| for transistor | TO 220
TO 248 SIP-Multiwatt TO 247 TO 218 |
| width | 13mm |
| height | 16mm |
| length | 21mm |
| thermal resistance | 21.2K/W |
| surface | solderable surface |
| version | without solder lug |
| material thickness | 0.6mm |
FK 269 MI 220 O
Board Level Heatsinks
| material | copper (Cu) |
| for transistor | TO 220
TO 248 SIP-Multiwatt TO 247 TO 218 |
| width | 13mm |
| height | 16mm |
| length | 21mm |
| thermal resistance | 21.2K/W |
| surface | solderable surface |
| version | without solder lug |
| material thickness | 0.6mm |
| Surface | |
|---|---|
| Length (mm) | 21mm |
| Width (mm) | 13mm |
| Height (mm) | 16mm |
DAU Components Limited
68 – 74 Barnham Road, Barnham West Sussex, PO22 0ES, UK
Tel: +44 (0) 1243 553031
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