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Heatsinks for BGAs – ICK BGA 23 x 23 x 10

Description

ICK BGA 23 x 23 x 10

For Processors

23 x 23 x 10 mm, for IC design BGA and others

way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
width	23mm
height	10mm
plate thickness	1.8mm
length	23mm
thermal resistance	21.5 – 6K/W
dissipation loss	2.9W
surface	black anodised